Originally posted 21 September 2026 by the employer.

This role focuses on designing complex flip-chip-BGA packages for ASICs with high-speed SerDes and very-high-power-delivery needs.

About the role

The team develops high-performance package designs for ASICs, including SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, and DDR5.

What you'll do

Create and track project plans for 20+ concurrent designs (scope, schedules, resources).
Improve scheduling methodologies and task tracking and coordination.
Organize team and customer activities to keep projects on track.
Communicate plans, status, next steps, and risks.
Create technical methodologies for package design.
Steer package technology and design rules with team input.

Bachelor's degree and 12+ years of related experience; or Master's degree and 10+ years of related experience.
Knowledge of package-level signal integrity and power integrity.
Technical understanding related to Package-Design lifecycle.
Understanding of how the substrate and package fit into the overall ASIC design and manufacturing flows.
Understanding of Design Data, including .mcm, package spreadsheet, and drawings (POD, Lid, Substrate).
Familiarity with DFx trade offs (Design for “x”, where is x is manufacturability, reliability, assurance of supply, SI/PI).
Experience with Layout, SI/PI extractions and Simulations, Automation code development, and Mechanical & Thermal modeling.

Skills: IC Package Design, flip-chip-BGA, SerDes, HBM, project plans