Applications Engineering, Staff Engineer
Originally posted 15 September 2026 by the employer.
About the role
This role involves leading technical engagements and deploying simulation solutions for semiconductor and electronics packaging engineers using Ansys software. This position focuses on structural, thermal, and reliability simulation problems.
What you'll do
- Lead technical engagements throughout the sales cycle, from discovery to live demos demonstrating Ansys software solutions.
- Work with semiconductor and electronics packaging engineers to configure, script, and deploy simulation solutions using Ansys tools.
- Build Python-based automation scripts and custom workflows using Ansys APIs for repeatable simulation processes.
- Collaborate with Ansys product teams to translate customer feedback into feature requests and test pre-release builds.
- Deliver consulting services and training sessions, from introductory workshops to deep-dive technical implementations.
- Support field marketing by authoring technical content, presenting at industry conferences, and creating application examples.
What you'll need
- BS in Mechanical Engineering or related field with 5+ years in an engineering software environment, or MS with 3+ years, or PhD with industry exposure to structural, thermal, or reliability simulation.
- Deep subject matter expertise in structural mechanics applied to electronics or semiconductor domains, including packaging, PCB assemblies, or chip-level reliability analysis.
- Hands-on experience with Ansys software or other commercial CAE tools like COMSOL, Abaqus.
- Strong Python scripting skills with demonstrated experience building automation workflows, integrating APIs, or developing custom applications on top of commercial engineering software.
- Ability to diagnose complex simulation problems, communicate technical tradeoffs clearly, and write documentation or presentations in fluent English.
- Willingness to travel domestically up to 25% of the time for customer meetings, on-site implementations, and industry events.
Skills: Ansys software, structural mechanics, electronics packaging, simulation solutions, Python scripting
This role has been open 27 days — below the 28-day median for Applications FAE roles.
Applications FAE · EDA Tools
|
Open roles in category
103
|
Median days open
28 d
|
Median salary
$162k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Synopsys | All employers we track in this specialty (103 roles · 11 employers) |
|---|---|---|
| Open roles in this specialty | 53 | 103 |
| Median days open | 25 d | 28 d (−3 d vs this employer) |
| Median salary (USD postings) | — | $162k |
Skills observed across this category: Ansys software, structural mechanics, electronics packaging, simulation solutions, Python scripting
Who's hiring in this category
- Synopsys (this employer) · 53 open roles · median 25 d
- Cadence Design Systems · 24 open roles · median 46 d
- Renesas Electronics · 9 open roles · median 61 d
- Keysight Technologies · 8 open roles · median 69 d
- AMD · 2 open roles · median 86 d
- Arteris · 2 open roles · median 113 d
How we counted: 103 open Applications FAE (EDA Tools) roles from 11 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.