Originally posted July 24, 2026 by the employer.
About the role
As an Applications Engineer, you will provide pre- and post-sales technical support to customers integrating Wolfspeed SiC substrates into 2.5D and 3D packaging architectures for high-performance computing (HPC) and AI data center applications. You will act as the technical bridge between Wolfspeed's materials expertise and the customer's package design, showing where SiC delivers value across heat spreaders, carriers, passive and active interposers, and package substrates.
What you'll do
- Guide customer packaging engineers, foundries, and OSATs in selecting optimal SiC use cases and incorporating SiC wafers and substrates into 2.5D/3D heterogeneous integration and CoWoS-style platforms.
- Identify and propose new SiC use cases and partner with customers, foundries, OSATs, and ecosystem players to co-design novel packaging architectures.
- Lead the design, development, and documentation of reference demonstrations for SiC interposer, heat-spreader, and substrate applications, including thermal performance benchmarks.
- Supply customers with validated SiC material characteristics, including anisotropic/directional thermal conductivity and bond-interface data, to drive accurate package-level thermal modeling.
- Develop and present technical materials at packaging industry conferences, tradeshows, and ecosystem partner workshops.
- Support new product and PDK launches, including training for sales teams, foundry partners, and EDA ecosystem players on SiC design rules, process windows, and integration guidelines.
What you'll need
- Bachelor's Degree in Electrical Engineering, Materials Science, or equivalent with relevant experience.
- Understanding of how hyperscalers, foundries, and OSATs specify advanced packages, and the ability to translate their thermal, power-density, warpage, cost, and reliability requirements into SiC material and product specifications.
- Understanding of advanced packaging architectures, including 2.5D/3D integration, interposer structures, TSV/TSiCV fabrication, and chiplet design.
- Experience with thermal simulation tools (e.g., ANSYS Icepak, FloTHERM) for package-level thermal analysis.
- Familiarity with packaging process flows: wafer thinning, via etching (RIE), metallization, micro-bump/hybrid bonding, and CTE mismatch considerations for SiC integration.
- Strong oral and written communication and presentation skills.
Nice to have
- Experience with EDA or simulation environments relevant to packaging (e.g., Cadence Sigrity, Synopsys) is a plus.
More semiconductor jobs: Wolfspeed jobs · Process engineer jobs
First seen in our index 112 days ago, well above the 46-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
96
|
Median days since first seen
46 d
|
Category median salary (all employers)
$171k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Wolfspeed | All employers we track in this specialty (96 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 96 |
| Open roles in the wider Process, Fab & Equipment family | 109 | 10378 · 119 employers |
| Median days since first seen | 112 d | 46 d (−66 d vs this employer) |
| Median salary (USD postings) | n/a | $171k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 52 d
- Intel Corporation · 12 open roles · median 98 d
- GlobalFoundries · 11 open roles · median 108 d
- SkyWater Technology · 11 open roles · median 24 d
- Applied Materials · 9 open roles · median 58 d
- Renesas Electronics · 5 open roles · median 60 d
How we counted: 96 open Process Integration (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 14 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.