APL Quantum Intern (Summer 2027) - USA - New York - Malta, United States
$20 - $40 USD yearly
Originally posted 8 October 2026 by the employer.
About the role
This internship involves contributing to quantum advanced packaging development, focusing on wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer development.
What you'll do
- Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
- Analyze and interpret engineering data from experiments, process optimizations, and development activities.
- Develop or support process models to improve understanding of advanced packaging and integration performance.
- Assist engineers with daily integration, process-development, documentation, and problem-solving activities.
- Communicate experimental results, technical findings, and recommended next steps to project stakeholders.
What you'll need
- At least a sophomore and actively pursuing a Bachelor's or Master's in Engineering or related field through an accredited degree program.
- Overall 3.0 GPA.
- English (Written & Verbal) fluency.
- Ability to work at least 40 hours per week during the internship.
Nice to have
- Prior related internship or co-op experience.
- Demonstrated prior leadership experience.
- Strong interest in leveraging AI tools and emerging technologies.
- Project management skills.
- Strong written and verbal communication skills.
- Strong planning & organizational skills.
- Currently pursuing a PhD in Engineering or related field.
- Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis.
- Availability for a six-month co-op assignment.
Skills: advanced packaging, hybrid bonding, TSV, interposers, design of experiments, process development
This role has been open 2 days — well below the 45-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
66
|
Median days open
45 d
|
Median salary
$173k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (66 roles · 25 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 66 |
| Median days open | 102 d | 45 d (+57 d vs this employer) |
| Median salary (USD postings) | — | $173k |
Skills observed across this category: advanced packaging, hybrid bonding, TSV, interposers, design of experiments, process development
Who's hiring in this category
- Micron Technology · 10 open roles · median 162 d
- AMD · 7 open roles · median 47 d
- Marvell Technology · 5 open roles · median 30 d
- Broadcom · 4 open roles · median 133 d
- GlobalFoundries (this employer) · 4 open roles · median 101 d
- Intel Corporation · 4 open roles · median 23 d
How we counted: 66 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 25 employers tracked in the SemiconductorJobs index, counted 11 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.