#Agentic AI Windows Power and Thermal Engineer
$94,200 - $141,200 USD yearly
Originally posted 7 July 2026 by the employer.
Windows power and thermal software development for Snapdragon compute chipsets.
About the role
This role involves developing Windows OS power and thermal software optimizations for Snapdragon processor platforms in compute devices.
What you'll do
- Lead OS-level power and performance optimization on Windows for Snapdragon chipsets. - Develop software features to improve battery life and performance across workloads including browser, gaming, productivity, and streaming. - Design algorithmic improvements to Windows kernel resource management schemes, including Windows Scheduler task placement and hardware IP power management. - Develop simulation models for rapid prototyping of software features. - Extend device analytics tools and platforms to analyze real-world usage of Snapdragon hardware. - Collaborate with hardware and software technology teams to identify and commercialize new hardware and software features.
What you'll need
- Bachelor's degree in Engineering, Information Systems, Computer Science, or a related field. - Expertise in Windows OS software. - Understanding of ARM-based System-on-Chip Architecture and digital systems.
Nice to have
- Proficiency in C, C++, Python, ARM Assembly Language, or JTAG. - Experience with Windows device drivers and Windows kernel development. - Understanding of Windows OS internals at the system level. - Experience with data analytics tools and Python libraries such as Pandas and NumPy.
Skills: Windows OS software, ARM System-on-Chip Architecture, power management solutions, Windows kernel, resource management
This role has been open 105 days — well above the 56-day median for Embedded Firmware Engineering roles.
Embedded Firmware Engineering · Systems Software
|
Open roles in category
736
|
Median days open
56 d
|
Median salary
$169k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Qualcomm | All employers we track in this specialty (736 roles · 85 employers) |
|---|---|---|
| Open roles in this specialty | 125 | 736 |
| Open roles in the wider Software, Firmware & Systems family | 728 | 6296 · 145 employers |
| Median days open | 51 d | 56 d (−5 d vs this employer) |
| Median salary (USD postings) | — | $169k |
Skills observed across this category: Windows OS software, ARM System-on-Chip Architecture, power management solutions, Windows kernel, resource management
Who's hiring in this category
- Qualcomm (this employer) · 123 open roles · median 51 d
- AMD · 63 open roles · median 39 d
- Micron Technology · 63 open roles · median 89 d
- NVIDIA · 54 open roles · median 62 d
- Lattice Semiconductor · 48 open roles · median 42 d
- NXP Semiconductors · 30 open roles · median 34 d
How we counted: 736 open Embedded Firmware Engineering (Systems Software) roles from 85 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.