Originally posted 15 September 2026 by the employer — open 0 days.
About the role
This role involves driving new technology introduction to support the product roadmap and establish relationships with foundry suppliers for base technology and custom silicon modules or devices.
What you'll do
- Drive New Technology Introduction to support the Product Roadmap.
- Establish relationships with foundry suppliers to guide development of base technology and custom silicon modules or devices.
- Work with IC design, marketing, and product engineering teams to establish product silicon technology needs.
- Work with cross-functional teams to solve performance and reliability issues on complex mixed-signal ICs.
- Support IC design and layout teams with specialist process knowledge, advising and reviewing SOA use conditions and design rule compliance, including DFM.
What you'll need
- Bachelor's/Master’s/PhD degree in Electronics, Physics, Materials Engineering, or equivalent, and 5+ years in semiconductor technologies.
- Detailed knowledge of device physics and reliability (e.g. HCI, TDDB, SOA characterization).
- Proven background in planar technology development, process integration, or technology transfer with knowledge of 180nm to 22nm processes.
- Knowledge of key analog & mixed-signal design, device and design rule requirements (e.g. noise, mismatch, Rdson, multiple voltage domains) and associated process implications.
- Strong data analysis skills with an analytical approach to assessing and identifying alternative courses of action for resolution of technical problems.
- Fluency in English and Mandarin.
Nice to have
- Demonstrated knowledge of semiconductor manufacturing processes, procedures, facilities and equipment.
- Experience in high voltage and BCD technology development or process integration.
- Prior experience working with external foundries.
- Prior experience collaborating with PDK & Modeling teams, and familiarity with layout and design rule review.
- Experience in passive and FET device characterization and modelling.
- Prior experience with PDK development, including supporting HV methodologies, DRM development.
- Test chip design and bench characterization experience.
Skills: New Technology Introduction, foundry suppliers, process integration, device physics, BCD technology
This role has been open 0 days — well below the 50-day median for Process Integration roles.
Process Integration · Process Integration
|
Open roles in category
208
|
Median days open
50 d
|
Median salary
$161k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Cirrus Logic | All employers we track in this specialty (208 roles · 35 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 208 |
| Open roles in the wider Process, Fab & Equipment family | 4 | 9336 · 110 employers |
| Median days open | 0 d | 50 d (−50 d vs this employer) |
| Median salary (USD postings) | — | $161k |
Skills observed across this category: New Technology Introduction, foundry suppliers, process integration, device physics, BCD technology
Who's hiring in this category
- Micron Technology · 72 open roles · median 59 d
- GlobalFoundries · 28 open roles · median 82 d
- Intel Corporation · 10 open roles · median 49 d
- onsemi · 8 open roles · median 47 d
- Renesas Electronics · 8 open roles · median 47 d
- Applied Materials · 7 open roles · median 31 d
How we counted: 208 open Process Integration (Process Integration) roles from 35 employers tracked in the SemiconductorJobs index, counted 15 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.