Advanced Packaging Technologist (Mechanical Modeling) - TX, Austin, United States
Digital Design & SoC Architecture
Originally posted 22 September 2026 by the employer.
About the role
What you'll do
- Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
- Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) and drive validation strategies.
- Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes.
- Engage with PCB suppliers, EMS partners, and component vendors to align material properties and process capabilities.
- Define targets and strategic direction for mechanical and package technology development and influence product roadmaps.
- Serve as a mechanical and multi-physics subject-matter expert for package and board-level architectures with a primary focus on data center platforms.
What you'll need
- Demonstrated experience owning model-based architecture and design decisions, supported by board-, package-, and system-level mechanical and multi-physics modeling, characterization and validation.
- Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage and stiffness control, and assembly constraints.
- Solid foundation in Mechanics, Fracture, Materials, Design & FEA with the ability to apply first-principles understanding to multi-physics package-and-system-level design & assembly trade-offs.
- Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
- Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
- Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.
- Track record of influencing experimental test plans and correlating simulation with physical test data (e.g., DOE design, instrumentation selection, or lab collaboration for model validation).
- Experience guiding or leading failure analysis investigations, translating FA/root-cause findings into design rules or model updates.
- MS or PhD in relevant Engineering disciplines or physics.
Nice to have
- Familiarity with AI/ML-based engineering workflows, such as surrogate/reduced-order modeling, automated optimization pipelines, or ML-assisted anomaly/failure detection applied to physics-based data.
Market context
This role has been open 19 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
940
|
Median days open
50 d
|
Median salary
$158k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (940 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 46 | 940 |
| Open roles in the wider Software, Firmware & Systems family | 407 | 6028 · 146 employers |
| Median days open | 51 d | 50 d (+1 d vs this employer) |
| Median salary (USD postings) | — | $158k |
Who's hiring in this category
- Intel Corporation · 70 open roles · median 30 d
- KLA Corporation · 59 open roles · median 39 d
- Applied Materials · 50 open roles · median 59 d
- NVIDIA · 49 open roles · median 65 d
- Teradyne · 48 open roles · median 23 d
- AMD (this employer) · 43 open roles · median 59 d
How we counted: 940 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 11 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.