Advanced Packaging TD Plating Module Engineer - Oregon, Hillsboro, United States
$133,800 - $255,200 USD yearly
Originally posted 8 October 2026 by the employer.
About the role
This role involves developing and optimizing advanced manufacturing processes and enabling high-volume manufacturing solutions for device architectures.
What you'll do
- Develop and optimize advanced manufacturing processes, including material selection, equipment metrology, and system design.
- Conduct feasibility studies and simulations to meet device performance and reliability specifications.
- Collaborate with equipment and material suppliers to design and implement innovative process technologies.
- Develop technology roadmaps to guide future manufacturing needs and set industry standards.
- Monitor production efficiency and recommend modifications to improve scalability and output.
- Utilize statistical process control and data analytics to ensure process stability and continuous improvement.
What you'll need
- Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 4+ years of relevant experience OR PhD in the same fields with 2+ years of relevant experience.
- 2+ years of experience in semiconductor processing or advanced packaging technology development.
- 2+ years of experience in process development methodologies, statistical process control or manufacturing process improvements.
Nice to have
- Strong technical expertise in plasma etch, plating processes, or thin-film deposition.
- Experience in wafer-level assembly, hybrid bonded interconnects, or advanced packaging technologies.
- Demonstrated success in leading programs from strategy formation to high-volume production.
This role has been open 2 days — well below the 66-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
74
|
Median days open
66 d
|
Median salary
$175k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (74 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 74 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9738 · 108 employers |
| Median days open | 38 d | 66 d (−28 d vs this employer) |
| Median salary (USD postings) | — | $175k |
Who's hiring in this category
- Micron Technology · 14 open roles · median 74 d
- GlobalFoundries · 10 open roles · median 110 d
- Applied Materials · 9 open roles · median 41 d
- Intel Corporation (this employer) · 9 open roles · median 38 d
- Renesas Electronics · 7 open roles · median 26 d
- Lumilens · 4 open roles · median 65 d
How we counted: 74 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 11 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
Similar Jobs
Development Engineering Senior Technician - Bloomington, MN 55425, United States
SkyWater Technology · 2401 E 86th St, Bloomington, MN 55425, United States
LFAB Process Technician - Day and Night Shift Available - Lehi, UT, United States
Texas Instruments · Lehi, UT, United States