Advanced Packaging Substrate Supplier Enablement Lead - Arizona, Phoenix, United States
Originally posted 22 September 2026 by the employer.
Focus on high density FCBGA, EMIB-T, and glass core substrate technologies.
About the role
This role involves leading substrate supplier development and qualification for advanced packaging technologies. You will ensure suppliers achieve readiness to support growing customer demand for technologies such as high density FCBGA, EMIB-T, and glass core substrate.
What you'll do
- Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
- Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
- Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
- Drive continuous improvement initiatives to minimize defects and optimize process reliability.
- Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
- Collaborate with internal teams and external stakeholders to align process strategies with program goals.
What you'll need
- Bachelor's degree in engineering, physics, materials science, or a related field, with 9+ years of relevant experience; or Master's degree with 6+ years; or PhD with 4+ years.
- Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments.
- Experience in advanced packaging, substrates, or semiconductor process development.
- Demonstrated expertise in structured problem solving and data-driven decision-making.
- Proven leadership in supplier management and technology enablement.
- Strong collaboration, influencing, and communication skills across global, cross-functional teams.
- Strategic mindset with the ability to align technical solutions with organizational objectives.
This role has been open 0 days — well below the 57-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
70
|
Median days open
57 d
|
Median salary
$175k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (70 roles · 20 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 70 |
| Open roles in the wider Process, Fab & Equipment family | 175 | 9479 · 109 employers |
| Median days open | 21 d | 57 d (−36 d vs this employer) |
| Median salary (USD postings) | — | $175k |
Who's hiring in this category
- Micron Technology · 14 open roles · median 103 d
- GlobalFoundries · 10 open roles · median 92 d
- Intel Corporation (this employer) · 10 open roles · median 27 d
- Applied Materials · 8 open roles · median 29 d
- Renesas Electronics · 6 open roles · median 38 d
- Lumilens · 4 open roles · median 47 d
How we counted: 70 open Process Integration (Advanced Packaging) roles from 20 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.