Advanced Packaging Process Integration Engineer - Principal - Kissimmee, FL 34744, USA
Originally posted 20 October 2026 by the employer.
Lead process integration for Si interposers, FanOut, and hybrid bonding architectures from concept through volume manufacturing.
About the role
As a Principal Advanced Packaging Process Integration Engineer at SkyWater Technology, you will lead, develop, and improve an overall integrated Advanced Packaging process flow to deliver qualified products to foundry clients. The role spans Si interposers, FanOut, and hybrid bonding technologies from concept through qualification and volume manufacturing.
What you'll do
- Translate client package specifications into process flows utilizing Si interposer, FanOut, and hybrid bonding manufacturing methods. - Integrate TSV first and/or TSV last process flows across temporary and permanent bonding, PVD, metal deposition, photolithography, etch, and CMP. - Collaborate with CAD engineers to validate incoming layout files and construct frames with metrology and electrical test structures. - Monitor inline and end-of-line SPC charts and parametric test results to drive root-cause investigations, defect reduction, and yield improvement. - Design and execute experiments (DOE) to validate and optimize recipes across fabrication and assembly equipment. - Interface with customers and cross-functional fab teams to deliver technical reviews and transition devices into full-scale production.
What you'll need
- BS in Engineering (MS or PhD preferred). - 10+ years of Process Development & Integration Engineer experience in an Advanced Packaging Fab or semiconductor fab environment related to FanOut wafer level assembly and Hybrid Bonding. - Working knowledge and hands-on experience with Advanced Packaging Fab processing tools. - Integration knowledge covering MEMS, Photonic, HPC, AI, ASIC, or Quantum devices. - Applied knowledge of DOE, SPC, and 6-sigma methodologies. - US Citizenship with the ability to obtain a government security clearance.
This role has been open 2 days — well below the 61-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
86
|
Median days open
61 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (86 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 86 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10073 · 106 employers |
| Median days open | 2 d | 61 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 37 d
- SkyWater Technology (this employer) · 12 open roles · median 2 d
- GlobalFoundries · 11 open roles · median 122 d
- Applied Materials · 8 open roles · median 36 d
- Intel Corporation · 8 open roles · median 83 d
- Renesas Electronics · 7 open roles · median 38 d
How we counted: 86 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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