Advanced Packaging Patterning Engineer - Staff - Kissimmee, FL 34744, USA
Originally posted 20 October 2026 by the employer.
Develop patterning process flows spanning Si interposer, FanOut, and hybrid bonding manufacturing.
About the role
The Advanced Packaging Patterning Engineer - Staff leads, develops, and improves the overall patterning process flow to deliver qualified products to foundry clients at the Florida Advanced Packaging site. The scope includes transferring package requirements into module flows spanning Si interposer, FanOut, superconducting materials, and hybrid bonding manufacturing processes.
What you'll do
- Transfer client package requests into module process flows utilizing Si interposer, FanOut, superconducting materials, and hybrid bonding manufacturing processes. - Create recipes leveraging patterning capabilities across liquid and dry film apply, expose, develop, and strip operations. - Integrate TSV first and TSV last process flows for devices across MEMS, photonics, high performance computing, CMOS, memory, AI, and quantum applications. - Utilize metrology tools to characterize process conditions, identify root causes of defects, and document results. - Routinely monitor in-line and end-of-line SPC charts for trends or excursions to address via integration changes. - Incorporate, monitor, and improve electrical test parametrics to deliver electrically verified packages.
What you'll need
- BS in Engineering (MS or PhD preferred). - 4+ years of Process Development and Integration experience in an Advanced Packaging Fab environment (10K and 1K cleanrooms) related to FanOut wafer level assembly, Quantum, Si Interposer, and Hybrid Bonding. - Design enablement skills in reticle layouts, reviews, and test-site installation. - Working knowledge and experience with Advanced Packaging Fab processing tools. - Knowledge of DOE, SPC, and 6-sigma concepts and applications. - US Citizenship with the holding of or ability to obtain a government security clearance.
Nice to have
- Project Management skills and/or defined training.
This role has been open 2 days — well below the 61-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
86
|
Median days open
61 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (86 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 86 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10073 · 106 employers |
| Median days open | 2 d | 61 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 37 d
- SkyWater Technology (this employer) · 12 open roles · median 2 d
- GlobalFoundries · 11 open roles · median 122 d
- Applied Materials · 8 open roles · median 36 d
- Intel Corporation · 8 open roles · median 83 d
- Renesas Electronics · 7 open roles · median 38 d
How we counted: 86 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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