Advanced Packaging Die Placement Engineer - Staff - Kissimmee, FL 34744, USA
Originally posted 20 October 2026 by the employer.
Develop die placement process flows utilizing Si interposers, FanOut, superconducting materials, and hybrid bonding.
About the role
SkyWater Technology is seeking an Advanced Packaging Die Placement Engineer - Staff to lead, develop, and improve die placement process flows for foundry clients at our Florida Advanced Packaging site. The role focuses on processes utilizing Si interposers, FanOut, superconducting materials, and hybrid bonding manufacturing technologies.
What you'll do
- Transfer client package requests into die placement and pick and place process flows utilizing Si interposers, FanOut, superconducting materials, and hybrid bonding manufacturing processes. - Lead module teams to develop packaging solutions, identify process flow gaps, and establish external partnerships for fast-turn prototyping. - Integrate TSV first and TSV last process flows across client designs including MEMS, Photonics, High Performance Computing, CMOS, Memory, AI, and Quantum devices. - Create equipment recipes that comprehend upstream and downstream requirements, utilizing metrology tools to characterize process conditions and identify root causes of defects. - Routinely monitor inline and end-of-line SPC charts and use data analysis software to address trends, excursions, and yield improvements. - Incorporate, monitor, and improve electrical test parametrics to deliver qualified, electrically good final packaging.
What you'll need
- BS in Engineering (MS/PhD preferred). - 5+ years of experience as a Process Development & Integration Engineer in an Advanced Packaging Fab environment (10K and 1K cleanrooms) related to FanOut wafer-level assembly, Quantum, Si Interposers, and Hybrid Bonding. - Working knowledge and hands-on experience with Advanced Packaging Fab processing tools. - Device and integration knowledge across MEMS, Photonic, HPC, AI, ASIC, or Quantum technologies. - Working knowledge of DOE, SPC, and 6-sigma concepts and applications. - U.S. Citizenship with the ability to obtain a government security clearance.
Nice to have
- Project Management skills and/or defined training.
This role has been open 2 days — well below the 61-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
86
|
Median days open
61 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (86 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 86 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10073 · 106 employers |
| Median days open | 2 d | 61 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 37 d
- SkyWater Technology (this employer) · 12 open roles · median 2 d
- GlobalFoundries · 11 open roles · median 122 d
- Applied Materials · 8 open roles · median 36 d
- Intel Corporation · 8 open roles · median 83 d
- Renesas Electronics · 7 open roles · median 38 d
How we counted: 86 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
Similar Jobs
Microelectronics Packaging Characterization & Diagnostics Engineer - Kissimmee, FL 34744, USA
SkyWater Technology · 200 NeoCity Wy, Kissimmee, FL 34744, USA
Manufacturing Senior Manager - Austin, TX 78741, USA
SkyWater Technology · 5204 E Ben White Blvd, Austin, TX 78741, USA