Advanced Packaging Designer - Power Modules - Zhubei, Hsinchu County, Taiwan
Originally posted 28 September 2026 by the employer.
About the role
This role involves leading the design, development, and optimization of advanced power module packaging solutions, focusing on mechanical, thermal, and electrical performance considerations.
What you'll do
- Develop and optimize power module package architectures from concept through production release.
- Create detailed APD layouts, package structures, and interconnect designs.
- Generate and maintain 3D models, mechanical drawings, and design documentation.
- Lead package design reviews and ensure compliance with product specifications and industry standards.
- Collaborate with electrical, mechanical, thermal, reliability, and manufacturing engineers to develop integrated packaging solutions.
- Support design trade-off analysis involving package size, cost, thermal performance, electrical performance, and manufacturability.
What you'll need
- Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Materials Engineering, Packaging Engineering, or a related field.
- 5-6+ years of experience in package design, semiconductor packaging, power electronics packaging, or related engineering disciplines.
- Advanced expertise in APD (Advanced Package Designer) and 3D modeling tools.
- Demonstrated experience designing power module packages for industrial, automotive, renewable energy, or high-power applications.
- Expert proficiency in Cadence APD.
- Expert proficiency in 3D CAD modeling tools (e.g., SolidWorks, Creo, or equivalent).
- Strong understanding of power module packaging technologies.
- Strong understanding of semiconductor packaging principles.
- Strong understanding of DBC, AMB, leadframe, and advanced substrate technologies.
- Strong understanding of wire bond and advanced interconnect technologies.
- Strong understanding of thermal interface materials and cooling solutions.
- Strong knowledge of mechanical design principles.
- Strong knowledge of thermal management and heat transfer.
- Strong knowledge of electrical design considerations including creepage, clearance, insulation, and parasitic effects.
- Experience interpreting thermal, mechanical, and electrical simulation results.
- Familiarity with design for manufacturability (DFM), design for assembly (DFA), and reliability principles.
Skills: power module package architectures, APD layouts, 3D modeling tools, thermal management, electrical performance
This role has been open 0 days — well below the 73-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
203
|
Median days open
73 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (203 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 203 |
| Open roles in the wider Process, Fab & Equipment family | 285 | 9488 · 108 employers |
| Median days open | 18 d | 73 d (−55 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: power module package architectures, APD layouts, 3D modeling tools, thermal management, electrical performance
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 39 d
- Renesas Electronics · 23 open roles · median 31 d
- Micron Technology · 18 open roles · median 150 d
- Intel Corporation · 12 open roles · median 156 d
- Monolithic Power Systems · 12 open roles · median 192 d
- onsemi (this employer) · 10 open roles · median 28 d
How we counted: 203 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.