Advanced Packaging Bond Debond Engineer - Sr. Staff - Kissimmee, FL 34744, USA
Originally posted 20 October 2026 by the employer.
Lead temporary and permanent bonding process flows utilizing Si interposer, FanOut, and hybrid bonding technologies.
About the role
This role leads, develops, and improves bonding and debonding process flows to deliver qualified products to foundry clients at SkyWater Technology's Florida Advanced Packaging site. Technical focus areas include temporary and permanent bonding across Si interposer, FanOut, and hybrid bonding manufacturing processes.
What you'll do
- Translate customer packaging requirements into bond and debond process flows utilizing Si interposers, FanOut, superconducting materials, and hybrid bonding. - Develop temporary bonding flows utilizing thermal, laser, or chemical release technologies alongside permanent bonding methods including fusion and hybrid bonding. - Integrate TSV first and TSV last process flows to support packaging for MEMS, photonics, HPC, CMOS, memory, AI, and quantum devices. - Utilize metrology tools to characterize process conditions, identify root causes of defects, and monitor in-line and end-of-line SPC charts. - Collaborate with process and tool engineers to create recipes, resolve processing marginalities, and improve yield and device performance. - Evaluate and improve electrical test parametrics to deliver electrically functional final packages.
What you'll need
- BS in Engineering (MS/PhD preferred). - 7+ years of experience as a Process Development & Integration Engineer in an Advanced Packaging Fab environment (Class 10K and 1K clean rooms). - Direct experience with FanOut wafer level assembly, Si interposer, hybrid bonding, or quantum technologies. - Hands-on knowledge and operational experience with Advanced Packaging Fab processing tools. - Working knowledge of DOE, SPC, and 6-sigma concepts and applications. - U.S. Citizenship with the ability to obtain a government security clearance.
Nice to have
- Project Management skills and/or defined training. - Device and integration knowledge across MEMS, photonics, HPC, AI, ASIC, or quantum devices combined with an advanced degree.
This role has been open 2 days — well below the 61-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
86
|
Median days open
61 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (86 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 86 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10073 · 106 employers |
| Median days open | 2 d | 61 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 37 d
- SkyWater Technology (this employer) · 12 open roles · median 2 d
- GlobalFoundries · 11 open roles · median 122 d
- Applied Materials · 8 open roles · median 36 d
- Intel Corporation · 8 open roles · median 83 d
- Renesas Electronics · 7 open roles · median 38 d
How we counted: 86 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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