Advanced Package Thermal Technologist - TX, Austin, United States
Digital Design & SoC Architecture
Originally posted 22 September 2026 by the employer.
This role focuses on data center and high-performance computing systems.
About the role
What you'll do
- Drive model-based architecture and design decisions for advanced package technologies.
- Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) and drive validation strategies.
- Engage with suppliers, partners, and component vendors to align material properties, process capabilities, and modeling assumptions.
- Define targets and strategic direction for thermal and package technology development and assess technology readiness.
- Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a primary focus on data center platforms.
What you'll need
- Demonstrated experience owning and driving model-based architecture and design decisions, supported by SoC, package, and system-level thermal modeling, characterization and validation.
- Solid foundation in Thermal and CFD first-principles understanding and multi-physics SoC-package-system-level design and assembly trade-offs.
- Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
- Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
- Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
- MS or PhD in relevant Engineering disciplines or physics.
Nice to have
- Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.
- Track record of influencing experimental test plans and correlating simulation with physical test data (e.g., DOE design, instrumentation selection, or lab collaboration for model validation).
- Familiarity with AI/ML-based engineering workflows, such as surrogate/reduced-order modeling, automated optimization pipelines, or ML-assisted anomaly/failure detection applied to physics-based data.
Market context
This role has been open 19 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
940
|
Median days open
50 d
|
Median salary
$158k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (940 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 46 | 940 |
| Open roles in the wider Software, Firmware & Systems family | 407 | 6028 · 146 employers |
| Median days open | 51 d | 50 d (+1 d vs this employer) |
| Median salary (USD postings) | — | $158k |
Who's hiring in this category
- Intel Corporation · 70 open roles · median 30 d
- KLA Corporation · 59 open roles · median 39 d
- Applied Materials · 50 open roles · median 59 d
- NVIDIA · 49 open roles · median 65 d
- Teradyne · 48 open roles · median 23 d
- AMD (this employer) · 43 open roles · median 59 d
How we counted: 940 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 11 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.