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Micron Technology

Advanced Package/Product Integration Sr. Manager - Taichung - AATT, Taiwan

Micron Technology Taichung - AATT, Taiwan Full-time 6 days ago
Packaging & Advanced Integration

Originally posted 30 September 2026 by the employer.

About the role

This role involves driving package product integration for advanced packaging technologies and providing cross-functional technical leadership.

What you'll do

  • Drive package product integration for advanced packaging technologies.
  • Identify integration risks and implement corrective actions during development.
  • Act as primary interface among product engineering, process engineering, manufacturing, suppliers, and customers.
  • Lead failure analysis and corrective action activities.
  • Support customer technical reviews and package feasibility assessments.
  • Drive root-cause investigations for package failures and improve package yield, reliability, and manufacturing robustness.

What you'll need

  • Experience in advanced package/product integration.
  • Ability to support design rule development and package architecture optimization.
  • Experience in cross-functional technical leadership.
  • Ability to drive alignment on technical decisions and risk mitigation plans.
  • Experience in customer support and technical engagement.
  • AI proficiency or AI-enabled skill set for working area.

Skills: advanced packaging, package product integration, design rule development, failure analysis, reliability improvement

Market context

This role has been open 6 days — well below the 60-day median for Packaging Engineering roles.

Packaging Engineering · Advanced Packaging

Open roles in category
311
Median days open
60 d
Median salary
$165k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Packaging Engineering hiring
Metric Micron Technology All employers we track in this specialty (311 roles · 59 employers)
Open roles in this specialty 37 311
Open roles in the wider Process, Fab & Equipment family 1486 9631 · 109 employers
Median days open 36 d 60 d (−24 d vs this employer)
Median salary (USD postings) — $165k

Skills observed across this category: advanced packaging, package product integration, design rule development, failure analysis, reliability improvement

Who's hiring in this category

  • KLA Corporation · 52 open roles · median 117 d
  • Micron Technology (this employer) · 36 open roles · median 38 d
  • Renesas Electronics · 21 open roles · median 36 d
  • Infineon Technologies · 17 open roles · median 54 d
  • onsemi · 15 open roles · median 27 d
  • GlobalFoundries · 13 open roles · median 69 d

How we counted: 311 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
Taichung - AATT, Taiwan
On-site
Full-time
6 days ago

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