Advanced Package Design Senior Staff Engineer - Santa Clara, CA, United States
$141,150 - $211,400 USD yearly
Originally posted 29 September 2026 by the employer.
About the role
What you'll do
- Lead package development and electrical design activities, including floorplanning, netlist creation, and BGA map definition.
- Optimize signal integrity, power integrity, performance, manufacturability, reliability, and cost of IC packages.
- Evaluate package technologies and drive layout implementation, ensuring designs meet product and manufacturing requirements.
- Define package requirements and develop achievable specifications in collaboration with marketing, system architects, and IC design teams.
What you'll need
- Bachelor's degree in Computer Science, Electrical Engineering, or related fields with 7+ years of experience OR Master's/PhD with 5+ years of experience.
- Experience with high-speed electronic packaging for digital and analog ICs, package floor planning, netlist, schematic, and BGA map development.
- Experience with 2.5D/3D package development.
- Knowledge of packaging technologies, materials, package substrate design rules, and assembly rules.
- Strong fundamentals in EM, transmission lines, and microwave theory.
Nice to have
- Experience with CPC/CPO connectors.
- Proficiency with IC package floor planning tools like Integrated System Planner (ISP) and layout tools like APD.
- Experience using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity.
- Experience with power plane design, modeling, and analysis using tools like PowerSI, SIwave.
- Ability to automate SI, PI, and Packaging activities using scripting tools like Python.
- Track record of new product introduction from concept, through development and production.
Skills: Advanced Package Design, high-speed electronic packaging, 2.5D/3D package, SI/PI, floorplanning, EM simulation
This role has been open 0 days — well below the 41-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
69
|
Median days open
41 d
|
Median salary
$173k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Marvell Technology | All employers we track in this specialty (69 roles · 25 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 69 |
| Median days open | 20 d | 41 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $173k |
Skills observed across this category: Advanced Package Design, high-speed electronic packaging, 2.5D/3D package, SI/PI, floorplanning, EM simulation
Who's hiring in this category
- Micron Technology · 12 open roles · median 151 d
- AMD · 6 open roles · median 35 d
- Marvell Technology (this employer) · 6 open roles · median 21 d
- Broadcom · 5 open roles · median 171 d
- Amazon · 4 open roles · median 20 d
- Intel Corporation · 4 open roles · median 11 d
How we counted: 69 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 25 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.