2027 Packaging Engineer - New Taipei City, Taiwan
Originally posted 18 September 2026 by the employer — open 0 days.
About the role
This role involves the design, development, and analysis of semiconductor packaging technologies to enable differentiation for Texas Instruments' analog and embedded processing products. The focus is on innovative packaging technologies for miniaturization, integration, high reliability, high performance, and low power.
What you'll do
- Partner with businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, and SIPs.
- Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage.
- Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance reliability and performance.
- Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and predict and prevent high risk designs.
What you'll need
- Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science, Physics, or Electrical Engineering.
- Cumulative 3.0/4.0 GPA, or higher.
Nice to have
- Basic understanding of statistical process control (SPC).
- Semiconductor packaging knowledge (manufacturing processes, assembly, reliability, materials, characterization, FA).
This role has been open 0 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 219 | 9374 · 108 employers |
| Median days open | 11 d | 53 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.